Plasma processing Cylos 160 RIE – system of AURION 
The RIE process (reactive ion etching) is a dry etching process used in electronic and microelectronic manufacturing. Applications are for example fast and ultra high surface cleaning, surface activation, photo-resist stripping and semiconductor etching.
•    Vacuum pumps for corrosive gases including oil mist filter and oil return system
•    Gas inlet system with up to 4 mass flow controllers
•    Tailor made gas shower for optimised distribution
•    Pressure measurement with capacitive or Pirani gauge
•    Impedance matching of the RF power through matching networks with automatic tuning designed and manufactured by AURION
•    Power-Split (when using more than one cathode)
•    DC bias control for equal bias potential at more than one cathode
•    Semiautomatic or PC control including data logging


Cressington Carbon Coater/Sputter Coater
The Cressington 108auto sputter coater offers the choice of manual or automatic operation. The specification also includes a vent gas inlet and argon purge control.

In automatic mode the coater can be controlled in two ways. The digital timer can be used to give repeatable coatings or the MTM-20 controller can be used to terminate the sputtering process at the desired thickness.
The sputter current and argon gas pressure are set independently for the desired coating conditions.

The Cressington 108auto sputter coater allow users for deposition of Carbon and metals such as Au, Pt, Pd, Ag and other non-magnetic metals.

sputter coater


Drop Shape Analyzer Kruss DSA25
The DSA25 Drop Shape Analyzer is designed for determining the wettability of solids by means of the contact angle as well as the surface tension of liquids such as coating substances or adhesives. The DSA25 Drop Shape Analyzer measures the static or dynamic contact angle with high precision and can also be used to determine the surface free energy by carrying out measurements with several liquids. The instrument provides rapid results for the wettability of a surface, for example for checking the quality of cleaned, pretreated, or coated samples. drop shape


SUSS MJB3 Mask Aligner
The Karl Suss MJB 3 Mask Aligner is designed for high resolution photolithography in a laboratory, development or pilot production environment. It can produce line/space photoresist images down to 0.6 um with alignment accuracy down to 1 um under optimum conditions.

It is capable of processing silicon, glass, or other standard wafers up to 3” diameter (round). This system is equipped with SUSS diffraction to reduce exposure optics. A 350W mercury short-arc lamp is used, providing a broadband of exposure wavelengths of 350-450 nm.

It can perform exposures in vacuum contact, hard contact, soft contact, or proximity mode.

Microscope:    M400 Normalfield with revolving objective turret and trinocular microscope head

Microscope Objectives:    Leitz NPL 5X, 10X, and 20X objectives
Microscope Oculars:    10X eyepieces
Lamphouse:    350W lamphouse

Lamp:    350W High Pressure Mercury (Hg) lamp is currently installed
Exposure Optics:    UV400
Substrate size: up to 3”
Approximate exposure intensity:    14.5 mW/cm2 at 365 nm, 25 mW/cm2 at 405 nm
Timer:    Digital
CIC Power Supply:    CIC 1000 constant intensity controller

mask aligner